sputter etching

英 [ˈspʌtə(r) ˈetʃɪŋ]

美 [ˈspʌtər ˈetʃɪŋ]

网络溅射蚀刻; 喷溅刻蚀; 溅击蚀刻; 溅射刻蚀; 溅镀蚀刻

In chapter II, basing on the microneedles fabricating process flow, the principles of every microfabrication process which were used in the flow, include sputter, microlithography, oxidation and etching, were introduced.
在第二章中，结合微针头的制作工艺流程，简单介绍了微针头制作过程中所采用的各种微细加工工艺的原理，包括溅射、光刻、氧化、腐蚀。
The Auger electron spectra connected with Ar ion sputter etching show that the thickness of the diffusion layer is about 0.2-2 μ m under our experimental conditions.
由氩离子溅蚀法所获得的Auger电子能谱数据来看，在实验条件下得到的扩散层的厚度约为0.2&2μm。
In this paper, the selection criterion of film deposition process and film material was established, and we selected sputtering and sputter etching to fabricate sidewalls.
本论文基于侧墙技术，确定了薄膜制备工艺和薄膜材料的选择标准，选择了溅射和溅射刻蚀工艺制备金侧墙。